Hype-Soft Thermally Conductive Interface Pads are used to transfer heat from a hot surface to a cooler region of the assembled design. The pads are designed in a variety if thermal conductivities and softness grades to provide excellent gap filling, low assembled stress and a high degree of wet-out for more efficient heat transfer. 
The pads are easily die-cut to most shapes, and have Polymeric Supporting Film on one side and a tacky conformable performance on the other side.

                                5516S        5519S        5591S         5592S     5595S
                                Soft Pad    Soft Pad    Ultra Soft        Soft        Soft    

Base Material            All are Filled Silicone Polymer
Thickness (mm)        All are .5, 1.0, 1.5, 2.0
Liner                         All are PET
Shore 00                    73                80            12.5            45            55
Conductivity W/m-k     3.1                4.1            1.0            1.1           1.6
Dielectrric Strength     3.1                3.1            7.9           14.7          15.7
Volume Resistivity      6.9 (10 14)     6.9(10 14)  2(10 12)    3(10 12)     5 (10 12)  
UL Flammability          V0                 V0             V0            V0            V0
Temp Range   (C)         
    Long Term            150                150            150            150         150
    Short Term           125                125            125            125         125