SSD Cooling Solutions
Non-Silicone Conductive SSD Cooling Solutions (2.5" Case & M.2 Solid State Drives)
Rathbun’s 3M Thermal non-silicone cooling material provides an excellent choice for use with SSD’s (Solid State Drives). 3M thermal conductive pads for SSD cooling do not produce silicone particulation, silicone oil bleed, or siloxane gas and can be used in all types of electronic applications. Our line of 3M non-silicone acrylic thermal pads, thermal tapes, and thermal labels are conformable, dielectric, completely safe and provide a proven long-life span.
Just as important, non-silicone acrylic thermal pads, thermal tapes, and thermal heat spreading labels are readily available with very short lead-times. They are easy to manufacture, for short manufacturing lead-times. This makes them a great solution for time-sensitive electronic deadlines.
Contact us for more information regarding our thermal conductive pads for SSD cooling and other thermal non-silicone SSD cooling supplies. Or you can call us at 510-661-0950 and we will be happy to resolve any thermal conductive pad questions that you may have.
Thermal Non-Silicone SSD Cooling Material Options3M is the world’s leader in the production of acrylic thermal non-silicone SSD cooling supplies. When compared to other silicone thermal options, Rathbun’s line of 3M acrylic non-silicone thermal pads, thermal tapes, and heat spreading thermal labels are exceedingly cost-effective. Whether you need cooling solutions for 2.5" Case or M.2 SSD’s, 3M non-silicone materials are the right solution for your specific needs.
Thermal Cooling for 2.5” Case SSD'sThermal pad solutions for 2.5” case drives, in both SATA and NVMe, can vary from a .2mm thick, 3W/m-K, UL-VO conformable thin thermal pad, to a very price-friendly 2W/m-K, up to 3.5W/m-K solution. Contact us today for more information about 3M non-silicone thermal solutions for your cooling needs.
Thermal Cooling for M.2 SSD'sRathbun’s high-performance non-silicone thermal solution for M.2 SSDs can utilize either NVMe or SATA form factor versions. Designed and manufactured by Rathbun, the heat spreading label thermal label can be used as both a thermal heat spreading cooler for the SOC and a heat spreading thermally conductive solution for the Nand without having to mix the cooling efforts.
Thermal Non-Silicone SSD Cooling Material ApplicationsProper contact between the pad and the device can be achieved by utilizing a dry, clean and well-unified surface. The best pre-application treatment chemicals are either rubbing alcohol or heptane, with the ideal application temperature range of 0° to 40° C. Acrylic thermal-based interface pads can be used within a wide range of electronic applications that require heat transfers from a warmer source to a cooler location, these include:
- Heat sink interface
- Solid State Drives
- LED boards
- IC packaging
- Gap filling
- HD TV’s
- Scan module boards
- COF chip heat conduction processes